Abstract

Provided is a method of forming a metal pattern by embossed patterning. The method of forming a metal pattern includes preparing a substrate, forming a metal adhesion inhibiting layer on the substrate, forming a metal adhesion pattern on the metal adhesion inhibiting layer, and applying and/or depositing a metal onto the substrate to form a metal pattern on the metal adhesion pattern, wherein the metal adhesion inhibiting layer includes a water-soluble polymer and a cellulose material.